quienes somos

como el principal fabricante de material semiconductor compuesto en China. pam-xiamen desarrolla avanzadas tecnologías de epitaxia y crecimiento de cristales, desde la primera generación de obleas de germanio, arseniuro de galio de segunda generación con crecimiento de sustratos y epitaxia en materi7
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después de más de 20 años de acumulación y desarrollo, nuestra compañía tiene una ventaja obvia en innovación tecnológica y grupo de talentos. en el futuro, necesitamos acelerar el ritmo de acción real para proporcionar a los clientes mejores productos y servicios
doctor chan -Ceo de xiamen powerway material avanzado co., ltd

nuestros productos

láser azul

plantillas gan

Los productos de plantilla de pam-xiamen consisten en capas cristalinas de nitruro de galio (gan), nitruro de aluminio (aln), nitruro de aluminio y galio (algan) y nitruro de indio y galio (ingan), que se depositan en sustratos de zafiro. Los productos de plantilla de carburo de silicio o silicon.pam-xiamen permiten tiempos de ciclo de epitaxia 20-7

gan en silicio

sustrato de gan independiente

pam-xiamen ha establecido la tecnología de fabricación para la oblea de substrato gan independiente (de nitruro de galio), que es para uhb-led y ld. cultivado por tecnología de epitaxia en fase de vapor de hidruro (hvpe), nuestro sustrato gan tiene baja densidad de defectos.

gaas cristal

obleas de gaas (arseniuro de galio)

pwam desarrolla y fabrica sustratos semiconductores compuestos: cristal de arseniuro de galio y wafer.we ha utilizado tecnología avanzada de crecimiento de cristales, congelación de gradiente vertical (vgf) y tecnología de procesamiento de obleas gaas, estableció una línea de producción de crecimiento de cristales, corte, pulido para procesamiento 7

cristal sic

epitaxy sic

proporcionamos epitaxy sic personalizada de película delgada (carburo de silicio) sobre sustratos de 6h o 4h para el desarrollo de dispositivos de carburo de silicio. sic epi wafer se utiliza principalmente para diodos schottky, transistores de efecto de campo de semiconductores de óxido de metal, transistores de efecto de campo de unión, transisto7

cristal sic

sustrato sic

pam-xiamen ofrece obleas de carburo de silicio semiconductoras, 6h sic y 4h sic en diferentes grados de calidad para el investigador y fabricantes de la industria. hemos desarrollado la tecnología de crecimiento de cristal sic y la tecnología de procesamiento de obleas de cristal sic, estableció una línea de producción para el sustrato sic del fabr7

gan expitaxy

oblea epitaxial led basada gan

La oblea epitaxial con base en gan (nitruro de galio) de pam-xiamen es para el ultra alto brillo en diodos emisores de luz azul y verde (led) y diodos láser (ld).

gan hemt epitaxy

gan hemt oblea epitaxial

Los dobladillos de nitruro de galio (transistores de alta movilidad de electrones) son la próxima generación de tecnología de transistor de potencia rf. Gracias a la tecnología gan, pam-xiamen ahora ofrece algan / gan hemt epi wafer en zafiro o silicio, y algan / gan en plantilla de zafiro .

cristal sic

reclamo de oblea sic

pam-xiamen puede ofrecer los siguientes servicios de reclamo sic reclaim.

Por qué elegirnos

  • soporte de tecnología gratuito y profesional

    puede obtener nuestro servicio de tecnología gratuito desde la consulta hasta el servicio posterior basado en nuestro Más de 25 experiencias en la línea de semiconductores.

  • buen servicio de ventas

    nuestro objetivo es cumplir con todos sus requisitos, no importa cuán pequeñas sean las órdenes y cuán difíciles son las preguntas pueden ser, para mantener un crecimiento sostenido y rentable para cada cliente a través de nuestros productos calificados y un servicio satisfactorio.

  • Más de 25 años de experiencia

    con más que 25 + años experiencias en el campo de material semiconductor compuesto y en el negocio de exportación, nuestro equipo puede asegurarle que podemos entender sus requisitos y tratar su proyecto profesionalmente.

  • calidad confiable

    la calidad es nuestra primera prioridad. pam-xiamen ha sido iso9001: 2008 , posee y comparte cuatro modernas facories que pueden proporcionar una amplia gama de productos calificados para satisfacer las diferentes necesidades de nuestros clientes, y cada pedido tiene que ser manejado a través de nue7

"Hemos estado utilizando las obleas epidérmicas de powerway para algunos de nuestros trabajos. Estamos muy impresionados con la calidad de la epi".
james s.speck, departamento de materiales de la universidad de california
2018-01-25
"Queridos equipos de pam-xiamen, gracias por su opinión profesional, el problema fue resuelto, estamos muy contentos de ser su compañero"
raman k. chauhan, seren fotónica
2018-01-25
"gracias por la respuesta rápida de mis preguntas y el precio competitivo, es muy útil para nosotros, ordenaremos de nuevo pronto"
markus sieger, universidad de ulm
2018-01-25
"Las obleas de carburo de silicio han llegado hoy, ¡y estamos muy contentos con ellas! ¡Felicitaciones a su equipo de producción!"
dennis, universidad de exeter
2018-01-25

las universidades y empresas más famosas del mundo confían en nosotros

últimas noticias

A Facile Method for Heteroepitaxial Growth of Homogeneous 3C-SiC Thin Films on Both Surfaces of Suspended Si Wafer by Conventional Chemical Vapor Deposition

2019-12-09

Although epitaxial growth of Si films on both surfaces of silicon wafer (epi-Si/Si-wafer/epi-Si) can be realized in foundry by means of mounting certain amounts of silicon wafers in a boat in commercial specialized chemical vapor deposition equipment (s-CVD), for its counterpart epi-SiC/Si-wafer/epi-SiC, neither is it readily realized in s-CVD, nor is it easily achieved in conventional chemical vapor deposition equipment (c-CVD) which is generally used for growth of 3C-SiC on single surface of silicon wafer (epi-SiC/Si-wafer). Since the growth of epi-SiC/Si-wafer/epi-SiC in one run is more efficient, and is anticipated, in this work, we demonstrated a facile method for growth of epi-SiC/Si-wafer/epi-SiC in c-CVD. The Si wafer was double-side polished and mounted in a suspension mode on the susceptor in the c-CVD chamber. It was found that homogeneous 3C-SiC(100) films were heteroepitaxially grown on both surfaces of the suspended Si(100) wafer simultaneously. The structural and electri...

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Growth and relaxation processes in Ge nanocrystals on free-standing Si(001) nanopillars

2019-12-02

Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Shock-recovery studies on InSb single crystals up to 24 GPa

2019-11-25

A series of shock-recovery experiments on InSb single crystals along the (100) or (111) axes up to 24 GPa were performed using flyer plate impact. The structures of recovered samples were characterized by X-ray diffraction (XRD) analysis. According to calculated peak pressures and temperatures, and phase diagram for InSb, the sample could undergo phase transitions from zinc-blende structure to high-pressure phases. However, the XRD trace of each sample corresponded to powder pattern of InSb with zinc-blende structure. The XRD trace of each sample revealed the absence of additional constituents including metastable phases and high-pressure phases of InSb except for samples shocked around 16 GPa. At 16 GPa, in addition to zinc-blende structure, additional peaks were obtained. One of these peaks may correspond to the Cmcm or Immm phase of InSb, and the other peaks were not identified. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send ...

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Integration of GaAs, GaN, and Si-CMOS on a common 200 mm Si substrate through multilayer transfer process

2019-11-18

The integration of III–V semiconductors (e.g., GaAs and GaN) and silicon-on-insulator (SOI)-CMOS on a 200 mm Si substrate is demonstrated. The SOI-CMOS donor wafer is temporarily bonded on a Si handle wafer and thinned down. A second GaAs/Ge/Si substrate is then bonded to the SOI-CMOS-containing handle wafer. After that, the Si from the GaAs/Ge/Si substrate is removed. The GaN/Si substrate is then bonded to the SOI–GaAs/Ge-containing handle wafer. Finally, the handle wafer is released to realize the SOI–GaAs/Ge/GaN/Si hybrid structure on a Si substrate. By this method, the functionalities of the materials used can be combined on a single Si platform. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Highly doped p-type 3C–SiC on 6H–SiC substrates

2019-11-11

Highly doped p-3C–SiC layers of good crystal perfection have been grown by sublimation epitaxy in vacuum. Analysis of the photoluminescence spectra and temperature dependence of the carrier concentration shows that at least two types of acceptor centers at ~EV + 0.25 eV and at EV + 0.06–0.07 eV exist in the samples studied. A conclusion is reached that layers of this kind can be used as p-emitters in 3C–SiC devices. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Photo-induced currents in CdZnTe crystals as a function of illumination wavelength

2019-11-05

We report variations in the currents of CdZnTe semiconductor crystals during exposure to a series of light emitting diodes of various wavelengths ranging from 470 to 950 nm. The changes in the steady-state current of one CdZnTe crystal with and without illumination along with the time dependence of the illumination effects are discussed. Analysis of the de-trapping and transient bulk currents during and after optical excitation yield insight into the behaviour of charge traps within the crystal. Similar behaviour is observed for illumination of a second CdZnTe crystal suggesting that the overall illumination effects are not crystal dependent. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Room-temperature bonding of GaAs//Si and GaN//GaAs wafers with low electrical resistance

2019-10-30

The electrical properties of room-temperature bonded wafers made from materials with different lattice constants, such as p-GaAs and n-Si, p-GaAs and n-Si [both with an indium tin oxide (ITO) surface layer], and n-GaN and p-GaAs, were investigated. The bonded p-GaAs//n-Si sample exhibited an electrical interface resistance of 2.8 × 10−1 Ωcm2 and showed ohmic-like characteristics. In contrast, the bonded p-GaAs/ITO//ITO/n-Si sample showed Schottky-like characteristics. The bonded n-GaN//p-GaAs wafer sample exhibited ohmic-like characteristics with an interface resistance of 2.7 Ωcm2. To our knowledge, this is the first reported instance of a bonded GaN//GaAs wafer with a low electrical resistance. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Epitaxial growth of Bi2Se3 layers on InP substrates by hot wall epitaxy

2019-10-21

The a-axis lattice parameter of Bi2Se3 is almost identical to the lattice periodicity of the InP (1 1 1) surface. We consequently obtain remarkably smooth Bi2Se3 (0 0 0 1) layers in hot-wall-epitaxy growth on InP (1 1 1)B substrates. The lattice-matched periodicity is preserved in the [1 1 0] and [] directions of the (0 0 1) surface. The Bi2Se3 layers grown on InP (0 0 1) substrates exhibit 12-fold in-plane symmetry as the [] direction of Bi2Se3 is aligned to either of the two directions. When the (1 1 1)-oriented InP substrates are inclined, the Bi2Se3 (0 0 0 1) layers are found to develop steps having a height of ~50 nm. The tilting of the Bi2Se3 [0 0 0 1] axis with respect to the growth surface is responsible for the creation of the steps. Epitaxial growth is thus evidenced to take place rather than van der Waals growth. We point out its implications on the surface states of topological insulators. Source:IOPscience For more information, please vis...

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Mid-infrared InAs/GaSb strained layer superlattice detectors with nBn design grown on a GaAs substrate

2019-09-29

We report on a type-II InAs/GaSb strained layer superlattice (SLS) photodetector (λ_{\rm cut\hbox{-}off}  ~4.3 µm at 77 K) with nBn design grown on a GaAs substrate using interfacial misfit dislocation arrays to minimize threading dislocations in the active region. At 77 K and 0.1 V of the applied bias, the dark current density was equal to 6 × 10−4 A cm−2 and the maximum specific detectivity D* was estimated to 1.2 × 1011 Jones (at 0 V). At 293 K, the zero-bias D* was found to be ~109 Jones which is comparable to the nBn InAs/GaSb SLS detector grown on the GaSb substrate. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Overview of recent direct wafer bonding advances and applications

2019-09-18

Direct wafer bonding processes are being increasingly used to achieve innovative stacking structures. Many of them have already been implemented in industrial applications. This article looks at direct bonding mechanisms, processes developed recently and trends. Homogeneous and heterogeneous bonded structures have been successfully achieved with various materials. Active, insulating or conductive materials have been widely investigated. This article gives an overview of Si and SiO2 direct wafer bonding processes and mechanisms, silicon-on-insulator type bonding, diverse material stacking and the transfer of devices. Direct bonding clearly enables the emergence and development of new applications, such as for microelectronics, microtechnologies, sensors, MEMs, optical devices, biotechnologies and 3D integration. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@g...

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