quienes somos

como el principal fabricante de material semiconductor compuesto en China. pam-xiamen desarrolla avanzadas tecnologías de epitaxia y crecimiento de cristales, desde la primera generación de obleas de germanio, arseniuro de galio de segunda generación con crecimiento de sustratos y epitaxia en materi7
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después de más de 20 años de acumulación y desarrollo, nuestra compañía tiene una ventaja obvia en innovación tecnológica y grupo de talentos. en el futuro, necesitamos acelerar el ritmo de acción real para proporcionar a los clientes mejores productos y servicios
doctor chan -Ceo de xiamen powerway material avanzado co., ltd

nuestros productos

láser azul

plantillas gan

Los productos de plantilla de pam-xiamen consisten en capas cristalinas de nitruro de galio (gan), nitruro de aluminio (aln), nitruro de aluminio y galio (algan) y nitruro de indio y galio (ingan), que se depositan en sustratos de zafiro. Los productos de plantilla de carburo de silicio o silicon.pam-xiamen permiten tiempos de ciclo de epitaxia 20-7

gan en silicio

sustrato de gan independiente

pam-xiamen ha establecido la tecnología de fabricación para la oblea de substrato gan independiente (de nitruro de galio), que es para uhb-led y ld. cultivado por tecnología de epitaxia en fase de vapor de hidruro (hvpe), nuestro sustrato gan tiene baja densidad de defectos.

gaas cristal

obleas de gaas (arseniuro de galio)

pwam desarrolla y fabrica sustratos semiconductores compuestos: cristal de arseniuro de galio y wafer.we ha utilizado tecnología avanzada de crecimiento de cristales, congelación de gradiente vertical (vgf) y tecnología de procesamiento de obleas gaas, estableció una línea de producción de crecimiento de cristales, corte, pulido para procesamiento 7

cristal sic

epitaxy sic

proporcionamos epitaxy sic personalizada de película delgada (carburo de silicio) sobre sustratos de 6h o 4h para el desarrollo de dispositivos de carburo de silicio. sic epi wafer se utiliza principalmente para diodos schottky, transistores de efecto de campo de semiconductores de óxido de metal, transistores de efecto de campo de unión, transisto7

cristal sic

sustrato sic

pam-xiamen ofrece obleas de carburo de silicio semiconductoras, 6h sic y 4h sic en diferentes grados de calidad para el investigador y fabricantes de la industria. hemos desarrollado la tecnología de crecimiento de cristal sic y la tecnología de procesamiento de obleas de cristal sic, estableció una línea de producción para el sustrato sic del fabr7

gan expitaxy

oblea epitaxial led basada gan

La oblea epitaxial con base en gan (nitruro de galio) de pam-xiamen es para el ultra alto brillo en diodos emisores de luz azul y verde (led) y diodos láser (ld).

gan hemt epitaxy

gan hemt oblea epitaxial

Los dobladillos de nitruro de galio (transistores de alta movilidad de electrones) son la próxima generación de tecnología de transistor de potencia rf. Gracias a la tecnología gan, pam-xiamen ahora ofrece algan / gan hemt epi wafer en zafiro o silicio, y algan / gan en plantilla de zafiro .

cristal sic

reclamo de oblea sic

pam-xiamen puede ofrecer los siguientes servicios de reclamo sic reclaim.

Por qué elegirnos

  • soporte de tecnología gratuito y profesional

    puede obtener nuestro servicio de tecnología gratuito desde la consulta hasta el servicio posterior basado en nuestro Más de 25 experiencias en la línea de semiconductores.

  • buen servicio de ventas

    nuestro objetivo es cumplir con todos sus requisitos, no importa cuán pequeñas sean las órdenes y cuán difíciles son las preguntas pueden ser, para mantener un crecimiento sostenido y rentable para cada cliente a través de nuestros productos calificados y un servicio satisfactorio.

  • Más de 25 años de experiencia

    con más que 25 + años experiencias en el campo de material semiconductor compuesto y en el negocio de exportación, nuestro equipo puede asegurarle que podemos entender sus requisitos y tratar su proyecto profesionalmente.

  • calidad confiable

    la calidad es nuestra primera prioridad. pam-xiamen ha sido iso9001: 2008 , posee y comparte cuatro modernas facories que pueden proporcionar una amplia gama de productos calificados para satisfacer las diferentes necesidades de nuestros clientes, y cada pedido tiene que ser manejado a través de nue7

"Hemos estado utilizando las obleas epidérmicas de powerway para algunos de nuestros trabajos. Estamos muy impresionados con la calidad de la epi".
james s.speck, departamento de materiales de la universidad de california
2018-01-25
"Queridos equipos de pam-xiamen, gracias por su opinión profesional, el problema fue resuelto, estamos muy contentos de ser su compañero"
raman k. chauhan, seren fotónica
2018-01-25
"gracias por la respuesta rápida de mis preguntas y el precio competitivo, es muy útil para nosotros, ordenaremos de nuevo pronto"
markus sieger, universidad de ulm
2018-01-25
"Las obleas de carburo de silicio han llegado hoy, ¡y estamos muy contentos con ellas! ¡Felicitaciones a su equipo de producción!"
dennis, universidad de exeter
2018-01-25

las universidades y empresas más famosas del mundo confían en nosotros

últimas noticias

Epitaxial growth of Bi2Se3 layers on InP substrates by hot wall epitaxy

2019-10-21

The a-axis lattice parameter of Bi2Se3 is almost identical to the lattice periodicity of the InP (1 1 1) surface. We consequently obtain remarkably smooth Bi2Se3 (0 0 0 1) layers in hot-wall-epitaxy growth on InP (1 1 1)B substrates. The lattice-matched periodicity is preserved in the [1 1 0] and [] directions of the (0 0 1) surface. The Bi2Se3 layers grown on InP (0 0 1) substrates exhibit 12-fold in-plane symmetry as the [] direction of Bi2Se3 is aligned to either of the two directions. When the (1 1 1)-oriented InP substrates are inclined, the Bi2Se3 (0 0 0 1) layers are found to develop steps having a height of ~50 nm. The tilting of the Bi2Se3 [0 0 0 1] axis with respect to the growth surface is responsible for the creation of the steps. Epitaxial growth is thus evidenced to take place rather than van der Waals growth. We point out its implications on the surface states of topological insulators. Source:IOPscience For more information, please vis...

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Mid-infrared InAs/GaSb strained layer superlattice detectors with nBn design grown on a GaAs substrate

2019-09-29

We report on a type-II InAs/GaSb strained layer superlattice (SLS) photodetector (λ_{\rm cut\hbox{-}off}  ~4.3 µm at 77 K) with nBn design grown on a GaAs substrate using interfacial misfit dislocation arrays to minimize threading dislocations in the active region. At 77 K and 0.1 V of the applied bias, the dark current density was equal to 6 × 10−4 A cm−2 and the maximum specific detectivity D* was estimated to 1.2 × 1011 Jones (at 0 V). At 293 K, the zero-bias D* was found to be ~109 Jones which is comparable to the nBn InAs/GaSb SLS detector grown on the GaSb substrate. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Overview of recent direct wafer bonding advances and applications

2019-09-18

Direct wafer bonding processes are being increasingly used to achieve innovative stacking structures. Many of them have already been implemented in industrial applications. This article looks at direct bonding mechanisms, processes developed recently and trends. Homogeneous and heterogeneous bonded structures have been successfully achieved with various materials. Active, insulating or conductive materials have been widely investigated. This article gives an overview of Si and SiO2 direct wafer bonding processes and mechanisms, silicon-on-insulator type bonding, diverse material stacking and the transfer of devices. Direct bonding clearly enables the emergence and development of new applications, such as for microelectronics, microtechnologies, sensors, MEMs, optical devices, biotechnologies and 3D integration. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@g...

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Japanese Journal of Applied Physics logo A Novel Diffusion Resistant P-Base Region Implantation for Accumulation Mode 4H–SiC Epi-Channel Field Effect Transistor

2019-09-11

A novel implantation technique using the carbon (C) and boron (B) sequential implantation is employed to control the B lateral and vertical diffusion from the p-base region of the planar silicon carbide (SiC) epi-channel field effect transistor (ECFET). The current deep level transient spectroscopy measurements were performed to establish the inter-correlation between the B enhanced diffusion and the electrically active defects introduced by the C and B sequential implantation. It was found that the formation of deep defect level is completely suppressed for the same ratio (C:B=10:1) as that for the B diffusion in 4H–SiC. A diffusion mechanism which is correlated to the formation of D center was proposed to account for the experimentally observed B enhanced diffusion. The effectiveness of C and B implantation technique in suppressing the junction field effect transistor (JFET) pinch effect is clearly visible from the 3–4 fold increase in drain current of fabricated 4H–SiC ECFET for p-b...

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Adding a Bit of Artificiality Makes Graphene Real for Electronics

2019-08-28

 We believes that one of the electronic capabilities for this device could be selecting the strength of the spin-orbit coupling in a p-type GaAs quantum well. This could lead to the creation of a topological insulator, which is an insulator on the inside but a conductor on the outside. Such an insulator could in turn enable so-called topological quantum computation, which is a theoretical approach to quantum computing that could be far more robust than current methods. This capability does not exist in natural graphene or other artificial graphene systems. Source:.ieee For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Two inch GaN substrates fabricated by the near equilibrium ammonothermal (NEAT) method

2019-08-19

This paper reports two inch gallium nitride (GaN) substrates fabricated from bulk GaN crystals grown in the near equilibrium ammonothermal method. 2'' GaN wafers sliced from bulk GaN crystals have a full width half maximum of the 002 X-ray rocking curve of 50 arcsec or less, a dislocation density of mid-105 cm−2 or less, and an electron density of about 2 × 1019 cm−3. The high electron density is attributed to an oxygen impurity in the crystal. Through extensive surface preparation, the Ga surface of the wafer shows an atomic step structure. Additionally, removal of subsurface damage was confirmed with grazing angle X-ray rocking curve measurements from the 114 diffraction. High-power p–n diode structures were grown with metalorganic chemical vapor deposition. The fabricated devices showed a breakdown voltage of over 1200 V with sufficiently low series resistance. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at s...

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Enhancement of the quality of InAsSb epilayers using InAsSb graded and InSb buffer layers grown by hot wall epitaxy

2019-08-12

We have investigated the structural and electrical properties of InAsxSb1−x epilayers grown on GaAs(0 0 1) substrates by hot wall epitaxy. The epilayers were grown on an InAsSb graded layer and an InSb buffer layer. The arsenic composition (x) of the InAsxSb1−x epilayer was calculated using x-ray diffraction and found to be 0.5. The graded layers were grown with As temperature gradients of 2 and 0.5 °C min−1. The three-dimensional (3D) island growth due to the large lattice mismatch between InAsSb and GaAs was observed by scanning electron microscopy. As the thicknesses of the InAsSb graded layer and the InSb buffer layer are increased, a transition from 3D island growth to two-dimensional plateau-like growth is observed. The x-ray rocking curve measurements indicate that full-width at half-maximum values of the epilayers were decreased by using the graded and buffer layers. A dramatic enhancement of the electron mobility of the grown layers was observed by Hall effect measurements. So...

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Quality Variation of ZnSe Heteroepitaxial Layers Correlated with Nonuniformity in the GaAs Substrate Wafer

2019-08-06

ZnSe layers are grown heteroepitaxially on substrates cut from a LEC-grown, undoped semi-insulating GaAs(100) wafer along the diameter parallel to the [001] axis. The intensities of free-exciton photoluminescence and X-ray diffraction from the ZnSe layers show an M-shaped profile along the GaAs wafer diameter, and are inversely correlated with the etch-pit-density distribution of the GaAs wafer. This observation gives, for the first time, experimental evidence that the quality of ZnSe heteroepitaxial layers grown by recent epitaxial techniques can be limited by the quality of GaAs substrates. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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Highly boron-doped germanium layers on Si(001) grown by carbon-mediated epitaxy

2019-07-29

Smooth and fully relaxed highly boron-doped germanium layers were grown directly on Si(001) substrates using carbon-mediated epitaxy. A doping level of  was measured by several methods. Using high-resolution x-ray diffraction we observed different lattice parameters for intrinsic and highly boron-doped samples. A lattice parameter of a Ge:B = 5.653 Å was calculated using the results obtained by reciprocal space mapping around the (113) reflection and the model of tetragonal distortion. The observed lattice contraction was adapted and brought in accordance with a theoretical model developed for ultra-highly boron-doped silicon. Raman spectroscopy was performed on the intrinsic and doped samples. A shift in the first order phonon scattering peak was observed and attributed to the high doping level. A doping level of  was calculated by comparison with literature. We also observed a difference between the intrinsic and doped sample in the range of second order phonon scattering. ...

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Epitaxial CdS Layers Deposited on InP Substrates

2019-07-22

The CdS layers were deposited on InP substrates by using the (H2–CdS) vapor growth technique. The single crystal layers of hexagonal CdS were obtained on InP (111), (110) and (100) with the following heteroepitaxial relationships; (0001) CdS//(111) InP and [bar 12bar 10] CdS//[01bar 1] InP, (01bar 13) CdS//(110) InP and [bar 2110] CdS//[bar 110] InP, (30bar 34) CdS//(100) InP and [bar 12bar 10] CdS//[01bar 1] InP. The CdS layers deposited on InP (bar 1bar 1bar 1) were identfied in terms of the twinned hexagonal crystals, twin planes of which were nearly parallel to (30bar 3bar 4) and its crystallographic equivalents. The compositional gradients were observed at the interface of the deposits and the substrates. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

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